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Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications (Softcover Reprint of the Original 1st 2015)

Three-Dimensional Integration of Semiconductors

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"Three-Dimensional Integration of Semiconductors" by Kazuo Kondo, Morihiro Kada, Kenji Takahashi is a physics book focused on Devices & Sensors. Best for students, educators, and scientifically curious readers.

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

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Best For: Researchers and engineers interested in semiconductor technology and three-dimensional integration techniques.
Focus: Background, construction methods, material selection, and applications of three-dimensional semiconductor integration.
Covers: Low energy consumption, high speed image processing, construction techniques, material use, applications in smart phones, driving assistance systems, capsule endoscopes, homing missiles, recent progress in 3D packaging, and future prospects.
Why It Matters: Provides detailed insights into advanced integration methods that enhance device performance and enable innovative applications across multiple technology fields.

"Three-Dimensional Integration of Semiconductors" by Kazuo Kondo, Morihiro Kada, Kenji Takahashi is a physics book focused on Devices & Sensors. Best for students, educators, and scientifically curious readers.

Topic: Devices & Sensors

Author: Kazuo Kondo, Morihiro Kada, Kenji Takahashi

Who this is for:

  • Physics students
  • Science-minded readers
  • Readers building technical understanding

Why this book matters: It provides structured coverage of physics concepts in a way that supports deeper understanding and continued study.

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

AuthorKazuo Kondo, Morihiro Kada, Kenji Takahashi
PublisherSpringer
Published2019-03-28
ISBN-139783319792552
BindingPaperback
Pages408
LanguageEnglish
SubjectsScience
TopicDevices & Sensors

Format: Paperback

Length: 408 pages

Language: English

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