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Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications (2015)

Three-Dimensional Integration of Semiconductors

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"Three-Dimensional Integration of Semiconductors" by Kazuo Kondo, Morihiro Kada, Kenji Takahashi is a physics book focused on Devices & Sensors. Best for students, educators, and scientifically curious readers.

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

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Best For: Researchers and engineers in semiconductor technology and device integration
Focus: Three-dimensional integration techniques, materials selection, and application development
Covers: Background on 3D integration, construction methods, material choices, applications in smart phones, driving assistance, medical devices, and defense, recent progress and future prospects
Why It Matters: Provides detailed insight into improving device performance through 3D integration, addressing energy efficiency and speed in advanced electronic systems

"Three-Dimensional Integration of Semiconductors" by Kazuo Kondo, Morihiro Kada, Kenji Takahashi is a physics book focused on Devices & Sensors. Best for students, educators, and scientifically curious readers.

Topic: Devices & Sensors

Author: Kazuo Kondo, Morihiro Kada, Kenji Takahashi

Who this is for:

  • Physics students
  • Science-minded readers
  • Readers building technical understanding

Why this book matters: It provides structured coverage of physics concepts in a way that supports deeper understanding and continued study.

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

AuthorKazuo Kondo, Morihiro Kada, Kenji Takahashi
PublisherSpringer
Published2015-12-16
ISBN-139783319186740
BindingHardcover
LanguageEnglish
SubjectsScience
TopicDevices & Sensors

Format: Hardcover

Language: English

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