Microscale Heat Conduction in Integrated Circuits and Their Constituent Films
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"Microscale Heat Conduction in Integrated Circuits and Their Constituent Films" by Y. Sungtaek Ju, Kenneth E. Goodson is a physics book focused on Dynamics. Best for students, educators, and scientifically curious readers.
The study of thermal phenomena in microdevices has attracted significant attention recently. The interdisciplinary nature of this topic, however, makes it very difficult for researchers to fully understand details of research results presented in journal articles. For many researchers intending to be active in this field, therefore, a more comprehensive treatment, complete with sufficient background information, is urgently needed. Advances in semiconductor device technology render the thermal characterization and design of ICs increasingly more important. The present book discusses experimental and theoretical studies of heat transfer in transistors and interconnects. A novel optical thermometry technique captures temperature fields with high temporal and spatial failures in devices that are subjected to electrical overstress (EOS) and electrostatic discharge (ESD). Also reported are techniques for determining the thermal transport properties of dielectric passivation layers and ultra-thin silicon-on-insulator (SOI) layers. Theoretical analysis on the data yields insight into the dependence of thermal properties on film processing conditions. The techniques and data presented here will greatly aid the thermal engineering of interconnects and transistors.
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"Microscale Heat Conduction in Integrated Circuits and Their Constituent Films" by Y. Sungtaek Ju, Kenneth E. Goodson is a physics book focused on Dynamics. Best for students, educators, and scientifically curious readers.
Topic: Dynamics
Author: Y. Sungtaek Ju, Kenneth E. Goodson
Who this is for:
- Physics students
- Science-minded readers
- Readers building technical understanding
Why this book matters: It provides structured coverage of physics concepts in a way that supports deeper understanding and continued study.
The study of thermal phenomena in microdevices has attracted significant attention recently. The interdisciplinary nature of this topic, however, makes it very difficult for researchers to fully understand details of research results presented in journal articles. For many researchers intending to be active in this field, therefore, a more comprehensive treatment, complete with sufficient background information, is urgently needed. Advances in semiconductor device technology render the thermal characterization and design of ICs increasingly more important. The present book discusses experimental and theoretical studies of heat transfer in transistors and interconnects. A novel optical thermometry technique captures temperature fields with high temporal and spatial failures in devices that are subjected to electrical overstress (EOS) and electrostatic discharge (ESD). Also reported are techniques for determining the thermal transport properties of dielectric passivation layers and ultra-thin silicon-on-insulator (SOI) layers. Theoretical analysis on the data yields insight into the dependence of thermal properties on film processing conditions. The techniques and data presented here will greatly aid the thermal engineering of interconnects and transistors.
| Author | Y. Sungtaek Ju, Kenneth E. Goodson |
| Publisher | Springer |
| Published | 2012-11-02 |
| ISBN-13 | 9781461373742 |
| Binding | Paperback |
| Language | English |
| Subjects | Technology & Engineering |
| Topic | Dynamics |
| Series | Microsystems |
Format: Paperback
Language: English
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