Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
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"Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces" by Qingke Zhang is a physics book focused on Dynamics. Best for students, educators, and scientifically curious readers.
This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.
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"Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces" by Qingke Zhang is a physics book focused on Dynamics. Best for students, educators, and scientifically curious readers.
Topic: Dynamics
Author: Qingke Zhang
Who this is for:
- Physics students
- Science-minded readers
- Readers building technical understanding
Why this book matters: It provides structured coverage of physics concepts in a way that supports deeper understanding and continued study.
This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.
| Author | Qingke Zhang |
| Publisher | Springer |
| Published | 2016-08-23 |
| ISBN-13 | 9783662517253 |
| Binding | Paperback |
| Pages | 143 |
| Language | English |
| Subjects | Science |
| Topic | Dynamics |
| Series | Springer Theses |
Format: Paperback
Length: 143 pages
Language: English
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