Electromigration Modeling at Circuit Layout Level
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"Electromigration Modeling at Circuit Layout Level" by Cher Ming Tan, Feifei He is a astronomy book and space science reference focused on Cosmology. Best for students, researchers, and serious astronomy enthusiasts.
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.
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"Electromigration Modeling at Circuit Layout Level" by Cher Ming Tan, Feifei He is a astronomy book and space science reference focused on Cosmology. Best for students, researchers, and serious astronomy enthusiasts.
Topic: Cosmology
Author: Cher Ming Tan, Feifei He
Who this is for:
- Astronomy students
- Researchers and advanced hobbyists
- Readers exploring space science topics
Why this book matters: It matters because it helps readers build a stronger understanding of astronomy concepts, observations, and scientific ideas related to space.
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.
| Author | Cher Ming Tan, Feifei He |
| Publisher | Springer |
| Published | 2013-05-04 |
| ISBN-13 | 9789814451208 |
| Binding | Paperback |
| Language | English |
| Subjects | Technology & Engineering |
| Topic | Cosmology |
| Series | Springerbriefs in Reliability |
Format: Paperback
Language: English
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