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Dry Etching for VLSI (1991)

Dry Etching for VLSI

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"Dry Etching for VLSI" by A.J. van Roosmalen, J.A.G. Baggerman, S.J.H. Brader is a physics book focused on Dynamics. Best for students, educators, and scientifically curious readers.

This book has been written as part of a series of scientific books being published by Plenum Press. The scope of the series is to review a chosen topic in each volume. To supplement this information, the abstracts to the most important references cited in the text are reprinted, thus allowing the reader to find in-depth material without having to refer to many additional publications. This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing. Although a number of books have appeared dealing with this area of physics and chemistry, these all deal with parts of the field. This book is unique in that it gives a compact, yet complete, in-depth overview of fundamentals, systems, processes, tools, and applications of etching with gas plasmas for VLSI. Examples are given throughout the fundamental sections, in order to give the reader a better insight in the meaning and magnitude of the many parameters relevant to dry etching. Electrical engineering concepts are emphasized to explain the pros and cons of reactor concepts and excitation frequency ranges. In the description of practical applications, extensive use is made of cross-referencing between processes and materials, as well as theory and practice. It is thus intended to provide a total model for understanding dry etching. The book has been written such that no previous knowledge of the subject is required. It is intended as a review of all aspects of dry etching for silicon semiconductor processing.

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Best For: Researchers and engineers working in semiconductor fabrication and plasma etching processes.
Focus: Detailed review of dry (plasma) etching techniques used in VLSI technology.
Covers: Scientific overview of dry etching methods with abstracts of key references for further study.
Why It Matters: Provides consolidated information on plasma etching, aiding understanding and development in semiconductor manufacturing.

"Dry Etching for VLSI" by A.J. van Roosmalen, J.A.G. Baggerman, S.J.H. Brader is a physics book focused on Dynamics. Best for students, educators, and scientifically curious readers.

Topic: Dynamics

Author: A.J. van Roosmalen, J.A.G. Baggerman, S.J.H. Brader

Who this is for:

  • Physics students
  • Science-minded readers
  • Readers building technical understanding

Why this book matters: It provides structured coverage of physics concepts in a way that supports deeper understanding and continued study.

This book has been written as part of a series of scientific books being published by Plenum Press. The scope of the series is to review a chosen topic in each volume. To supplement this information, the abstracts to the most important references cited in the text are reprinted, thus allowing the reader to find in-depth material without having to refer to many additional publications. This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing. Although a number of books have appeared dealing with this area of physics and chemistry, these all deal with parts of the field. This book is unique in that it gives a compact, yet complete, in-depth overview of fundamentals, systems, processes, tools, and applications of etching with gas plasmas for VLSI. Examples are given throughout the fundamental sections, in order to give the reader a better insight in the meaning and magnitude of the many parameters relevant to dry etching. Electrical engineering concepts are emphasized to explain the pros and cons of reactor concepts and excitation frequency ranges. In the description of practical applications, extensive use is made of cross-referencing between processes and materials, as well as theory and practice. It is thus intended to provide a total model for understanding dry etching. The book has been written such that no previous knowledge of the subject is required. It is intended as a review of all aspects of dry etching for silicon semiconductor processing.

AuthorA.J. van Roosmalen, J.A.G. Baggerman, S.J.H. Brader
PublisherSpringer Science & Business Media
Published1991-03-31
ISBN-139780306438356
BindingHardcover
Pages260
LanguageEnglish
SubjectsScience
TopicDynamics
SeriesUpdates in Applied Physics and Electrical Technology

Format: Hardcover

Length: 260 pages

Language: English

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