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Computational Materials System Design (2018)

Computational Materials System Design

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"Computational Materials System Design" by Dongwon Shin, James Saal is a physics book focused on Thermal Effects. Best for students, educators, and scientifically curious readers.

This book provides state-of-the-art computational approaches for accelerating materials discovery, synthesis, and processing using thermodynamics and kinetics. The authors deliver an overview of current practical computational tools for materials design in the field. They describe ways to integrate thermodynamics and kinetics and how the two can supplement each other.

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Best For: Researchers and engineers in materials science and environmental physics
Focus: Computational methods integrating thermodynamics and kinetics for materials design
Covers: Current computational tools for accelerating materials discovery, synthesis, and processing
Why It Matters: Combining thermodynamics and kinetics provides a comprehensive approach to improve materials design efficiency

"Computational Materials System Design" by Dongwon Shin, James Saal is a physics book focused on Thermal Effects. Best for students, educators, and scientifically curious readers.

Topic: Thermal Effects

Author: Dongwon Shin, James Saal

Who this is for:

  • Physics students
  • Science-minded readers
  • Readers building technical understanding

Why this book matters: It provides structured coverage of physics concepts in a way that supports deeper understanding and continued study.

This book provides state-of-the-art computational approaches for accelerating materials discovery, synthesis, and processing using thermodynamics and kinetics. The authors deliver an overview of current practical computational tools for materials design in the field. They describe ways to integrate thermodynamics and kinetics and how the two can supplement each other.

AuthorDongwon Shin, James Saal
PublisherSpringer
Published2017-11-20
ISBN-139783319682785
BindingHardcover
Pages233
LanguageEnglish
SubjectsTechnology & Engineering
TopicThermal Effects

Format: Hardcover

Length: 233 pages

Language: English

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